BEGIN:VCALENDAR
VERSION:2.0
METHOD:PUBLISH
CALSCALE:GREGORIAN
PRODID:-//WordPress - MECv7.33.0//EN
X-ORIGINAL-URL:https://cnbusinessforum.com/
X-WR-CALNAME:China Business Forum
X-WR-CALDESC:Your China Business Gateway
X-WR-TIMEZONE:Asia/Shanghai
BEGIN:VTIMEZONE
TZID:Asia/Shanghai
X-LIC-LOCATION:Asia/Shanghai
BEGIN:STANDARD
TZOFFSETFROM:+0800
TZOFFSETTO:+0800
TZNAME:CST
DTSTART:20260619T222645
END:STANDARD
END:VTIMEZONE
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-PUBLISHED-TTL:PT1H
X-MS-OLK-FORCEINSPECTOROPEN:TRUE
BEGIN:VEVENT
CLASS:PUBLIC
UID:MEC-bef4d169d8bddd17d68303877a3ea945@cnbusinessforum.com
DTSTART;TZID=Asia/Shanghai:20240828T000000
DTEND;TZID=Asia/Shanghai:20240830T230000
DTSTAMP:20241107T062616Z
CREATED:20241107
LAST-MODIFIED:20241109
PRIORITY:5
SEQUENCE:1
TRANSP:OPAQUE
SUMMARY:CMPE2024: 6th Precision Ceramics and Power Semiconductor Industry Chain Exhibition
DESCRIPTION:Join industry leaders from August 28-30, 2024, at the Shenzhen International Convention and Exhibition Center for the 6th Precision Ceramics and Power Semiconductor Industry Chain Exhibition. This event, organized by Aibang Zhizao, will spotlight the latest advancements in the power semiconductor and precision ceramics industries, showcasing cutting-edge technologies and products.\nIn the rapidly evolving fields of automotive electronics, photovoltaics, wind energy, new energy vehicles, and communications, power semiconductors are crucial for energy conversion and circuit control. This exhibition will highlight innovations in IGBT and SiC power devices, ceramic packaging, LTCC, HTCC, metalized ceramic substrates, and more.\nDiscover a wide range of products and solutions across a 20,000-square-meter exhibition area, with over 500 exhibitors and 1,000 booths. Experience firsthand the future of precision ceramics, electronic packaging materials, and power semiconductor devices.\nExhibition Highlights\n\nPrecision Ceramics and Materials: Including MLCC, LTCC, HTCC, piezoelectric ceramics, zirconia, alumina, silicon carbide, 3D printing ceramics, and bioceramics.\nCeramic Substrates and Packaging Shells: Featuring DPC, DBC, AMB, thin/thick film circuit boards, and more.\nMetal Materials and Additives: Such as silver, gold, copper powders, solder pastes, and dispersants.\nEquipment and Consumables: Showcasing ceramic processing, packaging, and testing equipment, alongside consumables like release films and cleaning agents.\nThermal Management Materials and Components: Highlighting alumina, boron nitride, graphene, heat sinks, phase change materials, and thermoelectric coolers.\nPower Semiconductor Device Packaging: Including materials like silicon carbide, bonding wires, thermally conductive silicone gels, and advanced packaging equipment.\n\nDon’t miss the concurrent Thermal Management Materials Exhibition, which will provide additional insights into the industry’s latest trends and technologies.\n
URL:https://cnbusinessforum.com/event/cmpe2024-6th-precision-ceramics-and-power-semiconductor-industry-chain-exhibition/
CATEGORIES:Trade Shows
LOCATION:Shenzhen International Convention and Exhibition Center (Baoan New Hall)
ATTACH;FMTTYPE=image/jpeg:https://cnbusinessforum.com/wp-content/uploads/2024/11/CMPE2024_6th_Precision_Ceramics_and_Power_Semiconductor_Expo.jpg
END:VEVENT
END:VCALENDAR
